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P475 – 1/2″ UHV sputter deposition HZB

Application

UHV sputter deposition system for thin film and multilayer deposition at 1/2″ substrates

Year of delivery

2020

Installation site

HZB, Berlin, Germany

Design Features

  • UHV magnetron sputter deposition system in confocal sputter up configurations.
  • Up to five 2″ magnetrons in confocal configuration.
    • All magnetrons with manual in situ source tilting.
    • All magnetrons with easy changeable magnetic system for use with ferromagentic or non-ferromagnetic target materials.
    • Low pressure and low power sputtering possible.
  • Partly motorized 4 axes sample manipulator with integrated pneumatic sample shutter, sample cooling and sample heating.
    • Motorized x-y translation.
    • Manual z translation and stage tilting (phi rotation).
    • Minimum sample temperature below -100°C.
    • Maximum sample temperature above 700°C.
  • Ion source option for sample precleaning and mild etching.
  • Thickness sensor setup with manual translation stage for sputter rate check before deposition.
  • Integrated bake out system.

Special Features

  • Two magnetrons can be additionally used in face to face configuration or in glace angle deposition configuration by sample stage tilting.
  • System is prepared to be part of a cluster tool, beam line systm or other type of vacuum system.
  • Later adding a load lock chamber possible.

Outer Dimensions

Technical specifications and performance values

General

Sputtering chamber

Size

400 mm diameter, about 600 mm height

Material

stainless steel

Vacuum

Sputtering chamber

Base pressure

< 7 * 10-9 mbar

Pump down time

< 5 hours to < 10-7 mbar

Chamber pumping

Turbo pumping stage, chamber lid differentially pumped by dry foreline pump

Bake out

< 150°C

Manipulator features

Sputtering chamber

Sample size

diameter max. 1/2″ substrate

Motion axes

4 axes (motorized x-y translation stage, manual z tranlsation and manual sample stage tilting)

Temperatures

< -100°C (not stabilized) up to 900°C at sample (short time heating) / > 700°C at sample (long time heating)

Special features

Software controlled wobble motion in x-y plane.

Performance test results

Chamber pump down
Long time sample heating
Motorized sample wobbling
Sputter source stability